FEM and CFD Analysis Solution for Semiconductor to Effectively Address Thermal and Structural Challenges Associated With Electronic Systems
Miniaturization and ongoing performance enhancements increase power consumption and heat generation within the electronic system. The high heat generation has adverse effects on the reliability and performance of the electronic system, creating the essential need for thermal management in all electronics products.
Our Computational Fluid Dynamics (CFD) analysis capabilities to analyze heat transfer phenomena from conventional air and liquid cooling methods to advanced cooling technologies such as thermal vapor chambers, cold plates, jet impingement mechanisms, Nanofluids, phase change materials have enabled us to identify high-temperature locations and recommend most appropriate design modifications to increase the cooling efficiency.
Our Finite Element Analysis (FEA) analysis services covering Static analysis, Modal analysis, Vibration, Sine sweep and Random vibration analysis, Shock analysis, Acceleration analysis, and Crash analysis have enabled our customers to assess the functionality and durability of a product during and after its exposure to intense conditions, as specified by Industry standards.
CFD Analysis Solutions for Semiconductor Efficiency
Our Institutional knowledge of thermal and structural solutions for electronic devices is the main factor that makes us distinctively different in the industry.
Our founders bring over 20 years of experience with global Semiconductor and technology companies like Lam Research Corporation, Applied Materials, and ISRO Satellite design centre. Our domain expertise is from ground systems to Satellite subsystems and Integrated Satellite level thermal design and analysis.
We worked with almost all leading Organizations in this segment, commencing with the Indian Space Research Organization, Defence Research and Development Organizations, Aeronautical Development Agency, Bharat Electronics Limited, and leading automotive OEM companies in Japan, Europe, and Germany.
Thermal design and CFD analysis
Forced air cooled, Conduction cooled, and Liquid cooled chassis design and CFD analysis
Active and passive thermal control system design
Fan selection, estimation of Fan operating point
Heat sink selection and custom design
Selection and design of air filters and vents
Proven experience with Compact thermal models like DELPHI, 2R models
Section and Implementation of passive thermal elements like Heat pipes, Optical solar reflectors, Multilayer Insulation
Panel level and Integrated Satellite level thermal analysis
Board level, Subsystem level, and Integrated level CFD analysis
Server room and data center CFD analysis
Structural analysis
Static structural and Thermal analysis
Modal analysis
Vibration: Sine sweep analysis
Acceleration analysis
Random vibration analysis
Shock analysis
Seismic analysis
Wind load analysis
Crash analysis
Mechanical design
Reverse Engineering
Concept Design
Sheet Metal Design
Chamber design
CAD Migration
Creo Services
UG-NX Services
2D to 3D Conversion
2D to 3D Modeling
Vector to Raster
Client Speak
NCES team carried out Thermal Analysis and Structural Analysis on a few of our Companys designs that are used for mission-critical applications of the Defence Research and Development Organization (DRDO) and Indian Space Research Organization (ISRO). We are impressed by their technical and analytical skills. We are delighted with the outcome.
Park Controls and Communications Pvt Ltd
Vice President (Technology )
We are impressed with the competence level of NCES in cooling solutions for Electronics. The thermal solution developed by NCES for our high-power density amplifier assembly meets all the functional requirements.
Bharat Electronics Limited
Sr. Manager, R&D
We worked with NCES to optimize the thermal design of the Automotive Power Control Unit (PCU). NCES expertise in the Electronics cooling domain and Quality of deliverables is Impressive.
