Services

FEM and CFD Analysis Solution for Semiconductor to Effectively Address Thermal and Structural Challenges Associated With Electronic Systems

Miniaturization and ongoing performance enhancements increase power consumption and heat generation within the electronic system. The high heat generation has adverse effects on the reliability and performance of the electronic system, creating the essential need for thermal management in all electronics products. Our Computational Fluid Dynamics (CFD) analysis capabilities to analyze heat transfer phenomena from conventional air and liquid cooling methods to advanced cooling technologies such as thermal vapor chambers, cold plates, jet impingement mechanisms, Nanofluids, phase change materials have enabled us to identify high-temperature locations and recommend most appropriate design modifications to increase the cooling efficiency.
Our Finite Element Analysis (FEA) analysis services covering Static analysis, Modal analysis, Vibration, Sine sweep and Random vibration analysis, Shock analysis, Acceleration analysis, and Crash analysis have enabled our customers to assess the functionality and durability of a product during and after its exposure to intense conditions, as specified by Industry standards.

CFD Analysis Solutions for Semiconductor Efficiency

Overview

Strong Institutional knowledge, customer-centric business model, experience with diverse customers

Our Institutional knowledge of thermal and structural solutions for electronic devices is the main factor that makes us distinctively different in the industry.
Our founders bring over 20 years of experience with global Semiconductor and technology companies like Lam Research Corporation, Applied Materials, and ISRO Satellite design centre. Our domain expertise is from ground systems to Satellite subsystems and Integrated Satellite level thermal design and analysis.
We worked with almost all leading Organizations in this segment, commencing with the Indian Space Research Organization, Defence Research and Development Organizations, Aeronautical Development Agency, Bharat Electronics Limited, and leading automotive OEM companies in Japan, Europe, and Germany.

Services

Forced air cooled, Conduction cooled, and Liquid cooled chassis design and CFD analysis

Active and passive thermal control system design

Fan selection, estimation of Fan operating point

Heat sink selection and custom design

Selection and design of air filters and vents

Proven experience with Compact thermal models like DELPHI, 2R models

Section and Implementation of passive thermal elements like Heat pipes, Optical solar reflectors, Multilayer Insulation

Panel level and Integrated Satellite level thermal analysis

Board level, Subsystem level, and Integrated level CFD analysis

Server room and data center CFD analysis

Static structural and Thermal analysis

Modal analysis

Vibration: Sine sweep analysis

Acceleration analysis

Random vibration analysis

Shock analysis

Seismic analysis

Wind load analysis

Crash analysis

Reverse Engineering

Concept Design

Sheet Metal Design

Chamber design

CAD Migration

Creo Services

UG-NX Services

2D to 3D Conversion

2D to 3D Modeling

Vector to Raster

Key Projects

Thermal analysis of FADEC (Full Authority Digital Engine Control Unit)- Flight engine electronic system, for DRDO, India

Development of a turn-key thermal solution for high heat flux power amplifier( GaN RF module) assembly for Bharat Electronics Limited, Ministry of Defence, Government of India

CFD analysis for Powerbox assembly for a Defence company, Israel

CFD analysis for 5G Multi Band Remote Radio Units (RU), for a leading 5G technology company, India

Thermal analysis of Telemetry Power Amplifier for Indian Space Research Organization (ISRO)

Thermal analysis of Telemetry Transmitter for Indian Space Research Organization (ISRO)

Thermal analysis of Integrated Telemetry Processor for Indian Space Research Organization (ISRO)

Thermal analysis and optimization for automotive power controller unit (PCU), for Marelli, Japan

Thermal analysis of signal processing actuator control electronic unit, for Bharat Electronics Limited, Ministry of Defence, Government of India

Thermal analysis of Flight data recorder and cockpit voice recorder for DRDO, India

Thermal analysis of Flight Test Telemetry Unit, for Aeronautical Development Agency, Ministry of Defence, India

CFD analysis of Liquid cooled plate - IGBT module, for a US client

CFD analysis of liquid-cooled ( water-Glycol based) electronic cooling system for a Sweden-based client

CFD analysis of bus bar unit for Schneider Electric

Dynamic FEM analysis for 5G Multi Band Remote Radio Units (RU) covering Modal analysis, Sinusoidal vibration, Random vibration, shock analysis, acceleration analysis, seismic analysis, and wind load analysis for a 5G technology company, India

Static and dynamic structural analysis for FADEC (Full Authority Digital Engine Control Unit)- Flight engine electronic system, for DRDO, India

Shock, vibration, and acceleration analysis for Flight data recorder and cockpit voice recorder, for DRDO, India

Acceleration analysis of signal processing actuator control electronic unit for Bharat Electronics Limited, Ministry of Defence, Government of India

Mechanical design review consultation for 5G Multi Band Remote Radio Units (RU)

Mechanical design 3D CAD model development of Full Authority Digital Engine Control Unit (FADEC)

Mechanical design of chassis and heat sink for power amplifier assembly

Detailing for 5G Multi Band Remote Radio Units (RU)

Mechanical design of Flight data recorder and cockpit voice recorder

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Client Speak

NCES team carried out Thermal Analysis and Structural Analysis on a few of our Companys designs that are used for mission-critical applications of the Defence Research and Development Organization (DRDO) and Indian Space Research Organization (ISRO). We are impressed by their technical and analytical skills. We are delighted with the outcome.

Park Controls and Communications Pvt Ltd

Vice President (Technology )

We are impressed with the competence level of NCES in cooling solutions for Electronics. The thermal solution developed by NCES for our high-power density amplifier assembly meets all the functional requirements.

Bharat Electronics Limited

Sr. Manager, R&D

We worked with NCES to optimize the thermal design of the Automotive Power Control Unit (PCU). NCES expertise in the Electronics cooling domain and Quality of deliverables is Impressive.

Tata Elxsi

Sr. Manager

Case Studies

Looking for specialised CFD Analysis & CAE Simulation services? drop a message

CFD analysis and thermal optimization for automotive Power train controller unit (PCU)

Our Client TATA Elxsi has approached us to optimize the thermal design of the Automotive Power train controller unit. The client has come with dimensional constraints and inputs from the Electronics hardware team. We have guided the client starting from conceptual heat sink design, performed Computational Fluid Dynamics (CFD) analysis, fine-tuned the design with the help of CFD analysis results, and finally presented our part of the work to the Japanese end user. We have addressed heat dissipation, thermal contact resistance, and other input data uncertainties. Read More

CFD analysis of Electronics control box

We executed this project for an electronics manufacturer in ISRAEL. The client has approached us with the initial thermal design. We performed a Computational Fluid Dynamics simulation (CFD analysis) and identified the thermal hot spots. We modified the heat sink design with our strong domain expertise, provided heat diffusers at critical locations, and finetuned the design from a thermal perspective. We performed thermal analysis for a worst-case scenario, and our engineering practices have enhanced our clients confidence. Read More

CFD analysis for Liquid cooled plate (LCP) – IGBT module

Our Client is an OEM providing integrated solutions for Industrial drives, Robotics, Power distribution, and Transportation Industry. The Client approached us with his previous LCP design and asked us to customize the same for his present need and to validate the customized design with CFD analysis. The customized design is validated with Computational Fluid Dynamics (CFD) analysis . Read More

CFD analysis of Multi Band Remote Radio Unit (RU)

The advent of 5G technology has brought about unprecedented advancements in wireless communications, enabling faster speeds, lower latency, and increased capacity. These advancements are associated with higher power consumption and increased heat generation in the 5G Remote Radio units.Increasing data rates and network densification require radio units to process larger volumes of data, leading to higher power consumption and heat generation. Environmental factors such as ambient temperature, humidity, and exposure to direct sunlight also impact the thermal aspects of the radio units. Read More

Wind Load analysis for multiband 5G Remote Radio Unit with Antenna using CFD

The seamless operation of base station antennas is of utmost importance for efficient and reliable communication networks. However, these antennas are constantly exposed to various environmental factors that can affect their performance and structural stability. Among these factors, wind load plays a significant role. Read More

DEVELOPMENT OF COOLING SOLUTION FOR GaN RF POWER AMPLIFIER

The demand for high-power and efficient radio frequency (RF) power amplifiers has been steadily increasing across various industries, including wireless communications, radar systems, and satellite communication. GaN (Gallium Nitride) technology has emerged as a game-changer in RF power amplification due to its exceptional performance characteristics and advantages over traditional technologies. GaN technology offers higher power density, improved efficiency, and wide bandwidth capability, setting it apart from traditional technologies like GaAs (Gallium Arsenide) or SiC (Silicon Carbide). Read More