Sophisticated Thermal and Structural Solutions for 5G and Telecom Devices
The Impressive performance of 5G devices is associated with significant thermal challenges resulting from Integration complexities and high heat flux devices like Power amplifiers. An efficient thermal cooling design is essential to manage the generated heat, which may limit RF performance and ultimately lead to reliability issues.
The structural integrity of the device shall be as per the telecom equipment Industry standards (ETSI EN 300 019-2-2) to ensure its durability during and after exposure to intense conditions. The manufacturer must validate the product for Random vibration, Sine Sweep, Shock, Seismic, Acceleration & Wind load requirements.
Our Institutional knowledge of thermal and structural solutions for electronic devices is the chief factor that makes us distinctively different in the industry. Our founders bring over 20 years of experience with global Semiconductor and technology companies like Lam Research Corporation, Applied Materials, and ISRO Satellite design center.
Our deep domain knowledge and expertise in Computational Fluid Dynamics (CFD) and Finite Element Analysis (FEA) software tools have enabled us to efficiently address thermal and structural issues associated with 5G and telecom devices and add value to our customers business.
Thermal Solutions for 5G and Telecom Devices
Comprehensive Engineering solutions: Design, Thermal, and Structural
Our portfolio of services for the 5G and Telecom Industry extends the Semiconductor Industry services offering. The knowledge and professional experience we gained with mission-critical electronic systems employed in Defence, aeronautical, and space applications have enabled us to address the thermal challenges of 5G-telecom devices with ease and efficiency.
We successfully addressed thermal and structural issues of the multiband 5G Remote Radio Unit both at the board level and Integrated system level. In addition to the thermal and structural issues, we predicted aerodynamics forces for 5G devices mounted on the tower and the tower structure aerodynamics phenomena.
Conduction cooled, and Liquid cooled chassis design and CFD analysis
Active and passive thermal control system design
Conduction, convection, and Radiation modeling
Heat sink – selection/custom design
Proven experience with Compact thermal models – DELPHI, 2R models, etc
Section and Implementation of passive thermal elements like Heat pipes, Optical solar reflectors, Multi-layer Insulation, etc.
Board level, Subsystem level, and Integrated level CFD analysis
Static structural and Thermal analysis
Modal analysis
Vibration - sine sweep analysis
Acceleration analysis
Random vibration analysis
Shock analysis
Seismic analysis
Wind load analysis
Crash analysis
3D Modeling
Reverse Engineering
Concept Design
Sheetmetal Design
Enclosure Design
Component packaging
CAD Migration
Creo Services
UG-NX Services
CFD analysis for 5G Multi band Remote Radio Units (RU), for a leading 5G technology company, India
CFD analysis of high heat flux GaN RF amplifier for signal jammer application
CFD analysis for telecom tower hexagonal structure
Aerodynamic drag analysis for multiband 5G Remote Radio Unit
Dynamic FEM analysis for 5G Multi Band Remote Radio Units (RU) covering Modal analysis, Sinusoidal vibration, Random vibration, shock analysis, acceleration analysis, seismic analysis, and wind load analysis for a 5G technology company, India
Dynamic FEM analysis for the dual-band and tri-band radio unit covering Modal analysis, Sinusoidal vibration, Random vibration, shock analysis, acceleration analysis, seismic analysis, and wind load analysis for a 5G technology company, India
Design of chassis with heat sink for GaN RF amplifier signal jammer
Design review for 5G Multi band Remote Radio Unit (RU)
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Case Studies
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